Dalishi Odorless and environmentally friendly epoxy large board adhesive is an environmentally friendly reactive tile adhesive. After the two components of the product are mixed in the proportion, it has an extremely strong bonding performance and is suitable for the wall and floor tiling of various stone slabs such as natural stone, ceramic tiles, and artificial rock slabs, as well as the bonding and reinforcement of various building materials.

1. wall floor natural stone, ceramic tiles, artificial rock slabs and other stone plate paving

2. bonding of stone, concrete, wood, metal materials, sintered bricks and other materials

3. Repair and reinforcement treatment of various building structures such as stone, concrete and steel structures

The construction methods for stone and slab materials can be selected based on the actual situation of the site and the user, such as point bonding, dry hanging or full laying.

1. [Material preparation]

according to the construction method and construction area, ready for the construction of plates, tools, protective materials and Hercules clean taste environmental protection epoxy large plate glue, and do a good job of the corresponding wall and ground protection;

2. [Base preparation]

first on the construction base surface, plate, etc. to check, the base is not firm for advance processing, plate oil film should be erased;

3. [

Line Positioning]

According to the design of the paving scheme, line drawing is carried out by using a wire spreader or a laser locator to determine the position of the plate, the cutting size of the plate and the reserved seam width, and at the same time according to the type of the plate. Mark the bonding point on the plate;

4. [Mixing glue]]

take out according to the dosage AB component is mixed and adjusted at a mass ratio of 1:1. It is recommended to control the amount of adhesive to 2-5kg for initial use, which is convenient for use and ensures no waste;

5. [Paving Wall]]

apply the adjusted glue to the bonding points of the plate with a gray knife or other tools, and the thickness of the glue at each point shall not be less3mm, use ceramic tile sucker to control the plate to go up the wall, when going up the wall, it is generally recommended to set up the bottom bracket from bottom to top;

6. [Kneading and leveling]]

According to the laser locator, adjust the plate direction and position, adjacent plates should be reserved for leveling and cross buckle, all plates after bonding, according to the leveling, plate position adjustment, to ensure that all plates in a horizontal or vertical plane;

7. [Construction Acceptance]

Hercules clean taste environmental protection epoxy large plate glue one day can reach the bond strength, the general proposal after the construction of the second day can be checked and accepted, confirm the bonding normal can be followed by the United States seam operation.

Dosage reference: when using the point hanging method for large board paving, the theoretical consumption of epoxy tile adhesive per ㎡ is about2-4kg, the specific dosage will vary greatly due to the base surface and plate conditions;

1. the pasting base surface shall be firm and solid, without floating ash and open water., when there is release agent on the concrete base surface, it should be treated in advance., derusting treatment shall be done when there is rust on the metal base surface.; if the pasting surface is too smooth, rough treatment must be made.

2. A, B two-component should be by weight ratio1:1 mix and adjust the glue first, bonding construction

3. the paste area per square meter of the plate should not be less104cm ², with a thickness of not less than 3mm

4. epoxy large plate glue initial stage of curing,Cannot carry heavy load

5. the construction temperature is lower5℃, can be heated in the adhesive area, but not higher65℃

6. when welding installation is required during construction, the welding spot shall be away from the adhesive paste.3cm above

7. it is forbidden to adjust glue on the bonding surface., otherwise, it will affect the bonding effect.